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Radient Technologies Inc. Announces Completion of Third and Final Tranche of Private Placement and Partial Closing of Shares for Debt Transaction

Oct 14, 16

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EDMONTON, ALBERTA October 14, 2016 - Radient Technologies Inc. (“Radient” or the “Corporation”) (TSX Venture: RTI) announces the completion of the third and final tranche of a non-brokered private placement of up to 70,000,000 units (the “Units”) of the Corporation at a price of $0.10 per Unit for aggregate proceeds of up to $7,000,000 (the “Offering”) previously announced by the Corporation on July 29, 2016.  Under the third tranche of the Offering, the Corporation issued and sold 6,520,158 Units for aggregate gross proceeds of $652,015.  The Corporation plans to use the proceeds of the Offering for product development, capital expenditures and general working capital purposes.

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